A wafer, also called a slice or substrate, is a thin slice of semiconductor, such as crystalline silicon, used to manufacture integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. Chemical mechanical planarization ( CMP ) or polishing is a critical step used multiple times in the semiconductor manufacturing process at each layer of the wafer to remove excess materials and create a smooth surface. This is done through the interaction of a pad and slurry on a polishing tool.
MARKET DYNAMICS
The wafer polishing materials market has witnessed significant growth due to rising demand for the chemical industry. Moreover, the increasing R&D activities provide a huge market opportunity for the key players operating in the wafer polishing materials market. However, strict government regulations are projected to hamper the overall growth of the wafer polishing materials market.
MARKET SCOPE
The "Global Wafer Polishing Materials Market Analysis to 2028" is a specialized and in-depth study of the chemical and materials industry with a special focus on the global market trend analysis. The report aims to provide an overview of the wafer polishing materials market with detailed market segmentation type, application, and geography. The global wafer polishing materials market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading wafer polishing materials market players and offers key trends and opportunities in the market.
MARKET SEGMENTATION
The global wafer polishing materials market is segmented on the basis of type and application. On the basis of type, the global wafer polishing materials market is divided into CMP slurry, CMP pads, post CMP Cceaning solution and others. On the basis of application, the global wafer polishing materials market is divided into 300 mm wafer, 200 mm wafer, 150 mm wafer and others.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global wafer polishing materials market based on various segments. It also provides market size and forecast estimates from the year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The wafer polishing materials market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the wafer polishing materials market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the wafer polishing materials market in these regions.
MARKET PLAYERS
The reports cover key developments in the wafer polishing materials market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market players from wafer polishing materials market is anticipated to lucrative growth opportunities in the future with the rising demand for wafer polishing materials in the global market. Below mentioned is the list of few companies engaged in the wafer polishing materials market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the wafer polishing materials market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
- 3M
- BASF SE
- CMC Materials
- DuPont
- FUJIBO
- Fujifilm
- Hitachi Chemical
- Mitsubishi Chemical Corporation
- Saint-Gobain
- TWI Incorporated
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.