Wafer back grinding tapes protect the wafer surface during the back grinding process and also prevent wafer surface contamination from the infiltration of grinding fluid. It offers various benefits such as overall cost reduction, prevention of wafer from breakage, and wafer surface protection. Hence, increasing the adoption of the wafer back grinding tape that drives the growth of the market. The usage of the wafer back grinding tapes in wafer fabrication ensures precision in wafer thickness after back grinding. Furthermore, a rise in need of semiconductor wafer fabrication for the production of electrical and photonic circuits are propelling the growth of the market. Continuous growth in the semiconductor industry is also fueling the growth of the wafer back grinding tape market.
MARKET SCOPE
The "Global Wafer Back Grinding Tape Market Analysis to 2028" is a specialized and in-depth study with a special focus on the global market trend analysis. The report aims to provide an overview of the wafer back grinding tape market with detailed market segmentation by type, wafer size, and geography. The report provides key statistics on the market status of the leading wafer back grinding tape market players and offers key trends and opportunities in the market.
MARKET SEGMENTATION
- Based on type, the global wafer back grinding tape market is bifurcated into UV Curable and non-UV.
- On the basis of wafer size, the market is segmented into 6-inch, 8-inch, 12-inch, and others.
MARKET DYNAMICS
Drivers:
- Wafer back grinding tapes help to hold packages during the dicing process. Moreover, this can be easily removed from wafer without stress using the irradiation technique. They are also used in various material, not only semiconductor wafer, but also glass, sapphire, ceramics, and others. This wide range of applications of wafer back grinding tape is boosting the growth of the market.
- An increase in investment in wafer fabrication equipment and materials are led to an increase in the demand for the wafer back grinding tape market.
- A rise in need for wafer fabrication, an increase in demand for ultra-thin wafers, and a growing focus toward wafer surface protection during the grinding process are expected to drive the growth of the wafer back grinding tape market.
Restraints:
- Increasing shift from non-UV to UV curable back grinding tapes that increase the overall cost of the manufacturing is expected to hinder the growth of the market.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2019 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The wafer back grinding tape market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the wafer back grinding tape market in these regions.
IMPACT OF COVID-19 ON WAFER BACK GRINDING TAPE MARKET
COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries in various countries due to lockdowns, travel bans, and business shutdowns. Shutdown of various plants and factories has affected the global supply chains and negatively impacted the manufacturing, delivery schedules, and sales of products in global market. Few companies have already announced possible delays in product deliveries and slump in future sales of their products. In addition to this, the global travel bans imposed by countries in Europe, Asia-Pacific, and North America are affecting the business collaborations and partnerships opportunities.
MARKET PLAYERS
The report covers key developments in the wafer back grinding tape market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from wafer back grinding tape market are anticipated to lucrative growth opportunities in the future with the rising demand in the global market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the wafer back grinding tape market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
- AI Technology, Inc.
- AMC Co.,Ltd
- Denka Company Limited
- Force-One Applied Materials
- FURUKAWA ELECTRIC CO., LTD.
- LINTEC ADVANCED TECHNOLOGIES (EUROPE) GmbH
- Loadpoint
- MITSUI CHEMICALS AMERICA, INC.
- NITTO DENKO CORPORATION
- Pantech Tape Co., Ltd.