Thermal interface pads, tapes, and epoxies offer high thermal conductivity either through interface conductivity or bulk conductivity. Thermal interface pads are conformable and soft, as well as provide high level of conductivity in most of the electronics applications. They offer good handling qualities and can be die-cut to fit into various applications. Thermal interface pads are designed with silicon and non-silicon elastomers. Thermal interface pads and materials address one of the important problems, i.e., heat dissipation, specifically for devices that are low powered. Thermal interface materials can dissipate sizable amount of heat that is generated.
Thermal interface materials are usually inserted between two working parts in order to enhance the thermal coupling between these parts. These parts are heat producing devices and heat dissipation devices.
MARKET DYNAMICS
The thermal interface pads are used extensively in the electronics industry, due to various factors such as high thermal performance, conformability, and easier application. Thermal interface pads and materials enhancing surface topography. Other important properties of thermal interface pads and materials are that they eliminate air gaps to reduce thermal resistance, also they can dampen even low stress vibrations. Further, they are compatible with automated dispensing equipment; and, they possess high conformability to reduce interfacial resistance between the mating surfaces.
MARKET SCOPE
The "Global Thermal interface pads and material Market Analysis to 2028" is a specialized and in-depth study of the thermal interface pads and material market with a special focus on the global market trend analysis. The report aims to provide an overview of thermal interface pads and material market with detailed market segmentation by type, material type, product, application, and geography. The global thermal interface pads and material market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading thermal interface pads and material market players and offers key trends and opportunities in the thermal interface pads and material market.
MARKET SEGMENTATION
The global thermal interface pads and material market is segmented on the basis of type, material type, product, application. On the basis of type, the market is segmented as thermal grease, phase change material, thermal pads, and others. On the basis of material type the market is segmented as gap pads, and phase change material. On the basis of product, the market is segmented into thyristor, IGBT, Mosfet, power transistors. Based on application the global thermal interface pads and material market is segmented into consumer electronics, telecom equipment, power supply units, and others.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global thermal interface pads and material market based on various segments. It also provides market size and forecast estimates from year 2020 to 2028 with respect to five major regions, namely, North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The thermal interface pads and material market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.
The report analyzes factors affecting thermal interface pads and material market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely, North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the thermal interface pads and material market in these regions.
MARKET PLAYERS
The reports cover key developments in the thermal interface pads and material market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from thermal interface pads and material market are anticipated to lucrative growth opportunities in the future with the rising demand for thermal interface pads and material market. Below mentioned is the list of few companies engaged in the thermal interface pads and material market.
The report also includes the profiles of key thermal interface pads and material market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.
- 3M
- Fujipoly
- Graftech International Holdings Inc.
- Henkel AG
- Honeywell International Inc.
- Laird Technologies
- Parker Hannifin Corp
- Stockwell Elastomerics, Inc.
- The Bergquist Company
- The Dow Chemical Company
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.