rf front-end chip Market

The RF front-end chip market size is expected US$ 18.52 billion in 2022 and is expected to reach US$ 47.10 billion by 2030; it is estimated to record a CAGR of 12.4% from 2022 to 2030.

The Asia Pacific RF front-end chip market is segmented into Australia, China, India, Japan, South Korea, and the Rest of Asia Pacific. In terms of revenue, China dominated the APAC RF front-end chip market share. The adoption of smartphones in Asia Pacific is growing rapidly. For example, according to the Mobile Economy APAC 2023 Report, released in June 2023 at an event organized by the GSMA and Singtel in Singapore, Mobile subscribers will increase by 400 million between 2022 and 2030, reaching 2.11 billion. Smartphone use is expected to reach 94% by 2030, up 18% from 2022, due to lower device costs and better digital literacy. In today's mobile devices, a complex circuit is responsible for transforming information from near-zero frequency band signals that are used to transport information and data into radio signals that are received or delivered over the air. RF front-end chip plays an important role in smartphones. Thus, the growing adoption of smartphones in the region propels the RF front-end chip market growth.

China is estimated to hold a highest RF front-end chip market share by 2030. The adoption of IoT is constantly growing across China. The most adopted IoT use case is condition-based maintenance of equipment, with an 81% adoption rate, followed by quality control using traditional machine vision (62%) and Industrial automation-based process control (62%). The concepts of IoT have been driving the evolution of wireless communications. With the ever-increasing demand for higher data rates, service carriers have improved the existing generation networks with carrier aggregation and multi-input multi-output (MIMO) antenna techniques, which are fulfilled by the Rf front-end chip. Thus, the growing adoption of IoT in China is driving the demand for wireless communication and connected devices, which is ultimately propelling the growth of the RF front-end chip market.

Broadcom Corporation, Infineon Technologies AG, Microchip Technology Inc., Murata Manufacturing Co., Ltd, NXP Semiconductors N.V., Qorvo Inc., Skyworks Solutions, Inc., STMicroelectronics, TDK Corporation, and Texas Instruments Incorporate are among the key players profiled in the RF front-end chip market report. The RF front-end chip market report also provides detailed market insights, which help the key players strategize their growth.

The overall RF front-end chip market size has been derived using both primary and secondary sources. Exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the RF front-end chip market analysis. The report includes growth prospects in light of current RF front-end chip market trends and driving factors influencing the market growth. The process also helps obtain an overview and forecast of the market with respect to all the market segments. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain analytical insights. This process includes industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the RF front-end chip market.