The Europe solder materials market is expected to grow from US$ 272.36 million in 2019 to US$ 408.21 million by 2030; it is estimated to grow at a CAGR of 3.8% from 2020 to 2030.
The increasing demand from the electronics industry is driving the growth of Europe solder materials market. Rising demand for various smart electronics and the advent of energy-efficient electronics are considered as the major factors expected to drive the European solder materials market. In addition to that, the rising production of electronic devices or gadgets in developing countries coupled with the presence of a notable electronics aftermarket industry is expected to boost the demand for such materials during the forecast period. This has further led to the introduction of the innovation of various sub-micron and nanoparticle-based solder materials. Hence, the solder materials market is likely to be propelled by the development in the sector of electronic refurbishing. The availability of various solder products is also among the other factors expected to positively influence the demand for solder materials.
The wire segment led the Europe solder materials market based on product in 2019. A soldered joint is basically used to attach a wire to the pin of a component on the rear of a printed circuit board. Solder wire is comprised of different types of alloys, or of pure tin. Each metal requires a certain type of solder wire to create strong bonds, since the combinations of metals that comprise solder wire melt at different temperatures. Some assemblies require the elimination of lead from the solder owing to its toxicity, and in these cases, some other elements would be substituted for the lead. They are mostly used in consumer electronics. Steel wire, screwdrivers, nails, and Alan wrenches are all potential tools for emergency solder. For electrical & electronics work, solder wire is available in the market with a range of thicknesses for hand-solder and with cores containing flux. It is further available as a room temperature paste. Jewelers often utilize solder in thin sheets, which they cut into snippets.
The overall Europe solder materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. The process also serves the purpose of obtaining overview and forecast for the Europe solder materials market with respect to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry experts, such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants, such as valuation experts, research analysts, and key opinion leaders specializing in the Europe solder materials market. Key players operating in the market include Fusion Incorporated; Indium Corporation; Kester; KOKI Company Ltd.; Lucas-Mihaupt Inc.; Qualitek International Inc.; Senju Metal Industry Co., Ltd.; Stannol GmbH and Co. KG; Tamura Corporation; and Nihon Genma