Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line or flat package. The entire bottom surface of the device can be used and traces connecting the package leads to wires connecting the die to the package, which are shorter hence provide better performance at high speed.
MARKET DYNAMICS
Rise in demand for high-performance denser type compact packaging in increasing number of diverse semiconductor and electronic devices such as smartphones, smartwatches, and TVs is the primary factor that propels the ball grid array (BGA) packaging market growth. However, non-compliant connectivity and difficulty of inspection, owing to critical and complex design of ball grid array (BGA) packaging tends to restrain the ball grid array (BGA) packaging market growth.
MARKET SCOPE
The "Global Ball Grid Array (BGA) Packaging Market Analysis to 2028"? is a specialized and in-depth study of the ball grid array (BGA) packaging market with a special focus on the global market trend analysis. The report aims to provide an overview of ball grid array (BGA) packaging market with detailed market segmentation by type, material type, industry vertical. The global ball grid array (BGA) packaging market expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading ball grid array (BGA) packaging market player and offers key trends and opportunities in the ball grid array (BGA) packaging market.
MARKET SEGMENTATION
The global ball grid array (BGA) packaging market is segmented on the basis of type, material type, industry vertical. On the basis of type, market is segmented as molded array process BGA, thermally enhanced BGA, package on package (Pop) BGA, micro BGA. On the basis of material type, market is segmented as ceramic, plastic, tape. On the basis of industry vertical, market is segmented as voltage, current, phase measurement, others. On the basis of end user, market is segmented as IT and telecommunication, consumer electronics, aerospace and defense, industrial, automotive, healthcare, others
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global ball grid array (BGA) packaging market based on various segments. It also provides market size and forecast estimates from year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The ball grid array (BGA) packaging market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.
The report analyzes factors affecting ball grid array (BGA) packaging market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the ball grid array (BGA) packaging market in these regions.
MARKET PLAYERS
The reports cover key developments in the ball grid array (BGA) packaging market organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from ball grid array (BGA) packaging market are anticipated to lucrative growth opportunities in the future with the rising demand for ball grid array (BGA) packaging market. Below mentioned is the list of few companies engaged in the ball grid array (BGA) packaging market.
The report also includes the profiles of key ball grid array (BGA) packaging market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.
- Amkor Technology
- TriQuint Semiconductor Inc.
- Jiangsu Changjiang Electronics Technology
- Corintech Ltd.
- STATS ChipPAC
- ASE Technology Holding
- Integrated Circuit Engineering Corp.
- Cypress Semiconductor Corp.
- Infineon Technologies AG
- NXP Semiconductors NV.
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