The APAC solder materials market is expected to grow from US$ 685.79 Mn in 2019 to US$ 1073.52 Mn by 2030; it is estimated to grow at a CAGR of 4.2% from 2020 to 2030.
The rise in demand in the electronics industry is driving the growth of APAC solder materials market. Rising demand for various smart electronics and the advent of energy-efficient electronics are considered as the major factors expected to drive the APAC solder materials market. In addition to that, the rising production of electronic devices or gadgets in developing countries coupled with the presence of a notable electronics aftermarket industry is expected to boost the demand for such materials during the forecast period. Conventional micrometer solder materials in the paste exhibit several shortcomings, such as high melting temperatures, which may result in undesired stress during the reflow processing, restricted applications, and defects in the joint. This has further led to the introduction of the innovation of various sub-micron and nanoparticle-based solder materials. Hence, the solder materials market is likely to be propelled by the development in the sector of electronic refurbishing. The accessibility to various solder products is also among the other factors expected to positively influence the demand for APAC solder materials market. The COVID 19 pandemic has impacted the APAC solder materials market and the revenue generated by the market. . The Airports Council International (ACI) Asia-Pacific warned that the prolonged duration of the COVID-19 (COVID-19) outbreak would drastically impact the region’s airports’ connectivity and economic sustainability, significantly restricting them from achieving previously forecasted growth prospects. Such closures are anticipated to negatively impact market growth in the coming period.
The wire segment led the APAC solder materials market based on product in 2019. A soldered joint is basically used to attach a wire to the pin of a component on the rear of a printed circuit board. Solder wire is comprised of different types of alloys, or of pure tin. Each metal requires a certain type of solder wire to create strong bonds, since the combinations of metals that comprise solder wire melt at different temperatures. The most common metals utilized in solder wire are Lead (Pb) as well as Tin (Sn). Soft solder basically melts in the range of 190-900°F. Some assemblies require the elimination of lead from the solder owing to its toxicity, and in these cases, some other elements would be substituted for the lead. Lead-free solders are increasing in use owing to regulatory requirements along with the health & environmental benefits towards avoiding lead-based electronic components. They are mostly used in consumer electronics. Steel wire, screwdrivers, nails, and Alan wrenches are all potential tools for emergency solder. For electrical & electronics work, solder wire is available in the market with a range of thicknesses for hand-solder and with cores containing flux. It is further available as a room temperature paste. Jewelers often utilize solder in thin sheets, which they cut into snippets.
The overall APAC solder materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. The process also serves the purpose of obtaining overview and forecast for the APAC solder materials market with respects to all the segments pertaining to the region. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data, as well as to gain more analytical insights into the topic. The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers along with external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the APAC solder materials market are Fusion Incorporated, Indium Corporation, Kester, KOKI Company Ltd., Lucas-Mihaupt Inc., Qualitek International Inc., Senju Metal Industry Co., Ltd., Stannol GmbH and Co. KG, Tamura Corporation, and Nihon Genma