A 3D IC (three-dimensional integrated circuit) is a package through multiple layers of silicon wafers stalked together, along with various electronic components utilizing through-silicon vias (TSVs). This emerging technology is getting propelled by the requirement of improving performance as well as the objective to reduce timing delays. As the functional integration requirement grows, assembly and wafer fabrication companies are increasingly seeking for 3D IC technology. 3D ICs are widely utilized in applications such as LED, sensors, memory, and others.
MARKET SCOPE
The "Global 3D IC Market Analysis to 2028" is a specialized and in-depth study with a special focus on the global market trend analysis. The report aims to provide an overview of the 3D IC market with detailed market segmentation by packaging technology, application, end-user, and geography. The report provides key statistics on the market status of the leading 3D IC market players and offers key trends and opportunities in the market.
MARKET SEGMENTATION
- Based on packaging technology, the global 3D IC market is segmented into 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 3D TSV.
- On the basis of application, the market is segmented into LED, memories, sensor, MEMS, and others.
- Based on end-user, the market is segmented into IT and telecom, consumer electronics, automotive, military and aerospace, and others.
MARKET DYNAMICS
Drivers:
- The major factor that is boosting the growth of the 3D IC market is the rising need for advanced architecture in the electronic products and growing trend of miniaturization of the electronics devices.
- Increasing adoption of high-end computing, data centers, and servers is anticipated to provide significant growth opportunities for the 3D IC market in the coming years.
Restraints
- High cost of the 3D ICs may hamper the growth of the 3D IC market.
REGIONAL FRAMEWORK
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2019 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The 3D IC market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the 3D IC market in these regions.
IMPACT OF COVID-19 ON 3D IC MARKET
COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries in various countries due to lockdowns, travel bans, and business shutdowns. Shutdown of various plants and factories has affected the global supply chains and negatively impacted the manufacturing, delivery schedules, and sales of products in global market. Few companies have already announced possible delays in product deliveries and slump in future sales of their products. In addition to this, the global travel bans imposed by countries in Europe, Asia-Pacific, and North America are affecting the business collaborations and partnerships opportunities.
MARKET PLAYERS
The report covers key developments in the 3D IC market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from 3D IC market are anticipated to lucrative growth opportunities in the future with the rising demand in the global market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the 3D IC market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
- Advanced Semiconductor Engineering, Inc.
- Amkor Technology
- IBM Corporation
- Intel Corporation
- Micron Technology, Inc.
- Samsung Electronics Co., Ltd.
- STMicroelectronics N.V.
- Taiwan Semiconductor Manufacturing Company Limited
- Toshiba Corporation
- Xilinx Inc.
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.