According to the new research report titled "Substrate-Like PCB Market Forecast to 2028 - COVID-19 Impact and Global Analysis," published by The Insight Partners, the market is expected to reach US$ 4,718.6 million by 2028, registering a CAGR of 17.8% from 2021 to 2028.
The growing demand for consumer electronics such as smartphones, tablets, smart bands, fitness bands, and wearables is driving the global substrate-like PCB market. The increasing adoption of substrate-like PCBs by smartphone manufacturers such as Apple and Samsung and investments in product development by key players are driving the substrate-like PCB market growth. A prime example of this is the 2020 launch of two "iPhone SE 2" models by Apple that used a 10-layer substrate-like PCB for the motherboard, manufactured by AT&S. The use of substrate-like PCBs allows for more battery space in smartphones as it enables thinner connections between key components, such as the DRAM, NAND flash memory, and application processor.
The automotive industry has experienced substantial growth in recent years, with an emphasis on consumer safety and comfort as the main design priorities for manufacturers. The growing use of substrate-like PCBs in connected vehicles is contributing to the substrate-like PCB market expansion. These vehicles feature both wired and wireless technologies that allow for connection to computing devices, such as smartphones. This connection enables drivers to remotely start the climate control system, check the battery status of their electric cars, and track their vehicles using their smartphones.
The advancements in smartphone technology, specifically the shift from 4G LTE to 5G support, have put a strain on RF front-ends and their required space in smartphones. As 5G systems are expected to process a rapidly growing amount of data, higher battery capacity is also necessary. To meet these demands, substrate-like PCBs are being developed to be thinner, smaller, and more intricate to accommodate more compact and high-density electronic components. The substrate-like PCB (SLP) is a cutting-edge high-density PCB technology that calls for trace and spacing measurements of equal to or less than 30/30 micrometers, enabling even smaller device sizes and freeing up space for other components. The growing demand for SLP by smartphone manufacturers in response to the transition from 4G to 5G technology presents a significant growth opportunity for substrate-like PCB market players. The expansion of 5G infrastructure is expected to increase demand for PCBs and substrates in end-user industries such as consumer electronics, automotive, medical, industrial, and telecommunications for use in mainboards and modules.
The substrate-like PCB market has been divided into various segments, including line/space, inspection technologies, and application. The line/space segment has further been divided into two categories: 25/25 and 30/30.
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