According to the new research report on "3D Stacking Market Size and Forecast (2021–2031), Global and Regional Share, Trends, and Growth Opportunity Analysis," published by The Insight Partners, the 3D stacking market is expected to reach US$ 5.94 billion by 2031 and register a CAGR of 16.0% from 2023 to 2031.
The gaming industry is continuously growing across the globe, with a rise in video game players. According to Accenture, in 2021, the gaming industry will be exceeded by US$ 300 million and reach over 400 million in 2023. The industry witnessed an increase of half a billion players in the past three years, accounting for 2.7 billion people worldwide. The launch of new gaming platforms and changing demographics are diverting gaming businesses from being product-centric by encouraging them to launch experience-oriented platforms. According to Accenture, gamers spend an average of 16 hours per week playing, eight hours watching or participating in game streams, and six hours interacting in game forums and communities. These social interactions are one of the primary drivers of online gaming's growth. The growing number of online gamers increases the need for high-speed processors among gamers. In April 2022, Advanced Micro Devices Inc. released a Ryzen 7 5800X3D Gaming Processor to improve and enhance gamers' experience. Ryzen 7 5800X3D gaming processor is designed with 3D stake technology that can deliver an average of 15% more gaming performance at 1080p. Further, processor speed is important, particularly when it comes to gaming and other intense tasks. Faster processors can cut load times, allowing users to get into their games quickly. They also facilitate multitasking by allowing numerous applications and programs to operate concurrently without causing slowdowns or lag. Also, greater processing speeds enable higher graphical settings and frame rates in games, resulting in a smoother experience with no stuttering or noticeable lag. Thus, the growing integration of fast processors for gaming purposes is expected to emerge as a significant trend in the 3D stacking market in the coming years.
In APAC, China is the largest manufacturer of consumer electronic devices. According to Nikkei Inc., the Government of China expanded the country's domestic electronic market by investing US$ 327 billion till 2023. The Government of India also aims to expand the electronics market in the country. Furthermore, the electronics sector in APAC accounts for 20–50% of Asia Pacific's total value of exports. Smart speakers, home assistants, and smart cameras utilize 3D stacked memory and processors to enhance performance and features while maintaining a small footprint. As APAC is the largest electronic manufacturer, the demand for 3D stacking is expected to rise during the forecast period.
Key Findings of Study:
On the basis of interconnecting technology, the 3D stacking market is segmented through-silicon vias, monolithic 3D integration, and 3D hybrid bonding. Through-Silicon Vias (TSVs) are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. TSVs are used to build 2.5D and 3D packages that include multiple semiconductors dies. The structures facilitate vertical stacking without the edge wiring or wire bonding that was previously employed in stacked packages on organic substrates. TSVs are present in two areas: interposers and stacked chiplets. In 2.5D and 3D packages on interposers, TSVs provide vertical interconnects between buildup layers in the package substrate. In 3D packaging, TSVs are placed in die stacks to make connections without edge wiring along the edge of the stack.
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